Cost effective, as low as 45K!

12" Rotating Industrial Wafer Systems

12" Rotation Industrial Wafer systems include：

Single wafer ALD 12 inches, rotates to improve uniformity.
Allumium alloy wafer holder for small wafer sizes.
Compact, well-engineered design for controlled processing.
Options include precusor bottle level sensor; plasma enhance; turbo pump; loadlock et. al.

System Architecture

Designed for industrial productions

12 inch rotation wafer industrial: single 12 inch or multiple smaller wafers, 3 precursors, 2 precursor lines, precursor level sensor

Substrates

Vapor Delivery

Process Control

Supports 2–12 inch Wafer Samples

Roting Wafer Plate

Thermal & Plasma Options

Aluminum alloy sample holders accommodate multiple wafers smaller than 12 inches. The size and shape of the heated substrate can be customized for your applications.

The rotating wafer plate improves uniformity. Direct plate heating rapidly raises the wafer temperature, and provides minimal chamber volume. Both speeds up the process.

Compatible with standard thermal deposition and optional plasma-assisted modules for low-temperature metal oxide, nitride, and pure metal layers.

Specification table

450 °C

maximum substrate heating

2~12 in

standard wafer diameter

2/3 lines

precursor delivery channels

 Chamber: Aluminum alloy, 480 mm × 450 mm, with a 400 mm inner diameter and a top-lifting lid.

 Stage: Approximately 310 mm in diameter, rotatable, with adjustable speeds. RT~450 °C.

 Wafer carrier: Standard 3" or 4" multi-wafer carrier, or a custom carrier.

 Gas inlet: Top-mounted showerhead type.

 Inlets: Carrier gas (N2 or Ar; inlet pressure ≥0.2 MPa), purge gas (N2 or Ar; inlet pressure ≥0.2 MPa), and pneumatic gas (compressed air or pressurized N2/air; inlet pressure ≥0.4 MPa). VCR connectors.

 Inlet gas controls: Three MFCs for two precursor carrier gases and one purge gas.

 Temperature: Multiple independently controlled points. Maximum 150 ℃ for most points and 450 ℃ for the wafer stage.

 Precursors: W500 or 500 mL stainless steel bubbler bottle, with PID temperature control and a 1/4“ VCR connector. Liquid level sensor optional.

 Outlet: Standard KF25 connection.

 Operating system: Windows-based software.

 Dimensions: 142 cm (W) × 78 cm (D) × 125 cm (H).

Contact Engineering Team

Configure Your ALD System

Consult directly with thinfilm process specialists to review custom chamber volumes, gas delivery configurations, and specific precursor chemistries.

Angstrom Thinfilm Technologies

2825 Broadbent Business Park, Unit AAlbuquerque, NM 87107, USA

Headquarter

1120 Nimitz Ln, Foster City, CA 94404, USA