Cost effective, as low as 45K!

ANGSTROM-DEP ALD SYSTERMS

Angstrom-dep® Atomic Layer Depostion (ALD) system is develped by Angstrom Thinfilm Company．

​The company founded in 2008. The company is the pioneers of powder ALD functioning and commercial systems in the world. The company also have close colaboration with US national labs and universities in the fields of high temperature ALD and plasma ALD application of nanoparticle functionalization, nanoporous material property enhancements. The company has been awarded national 100 R&D in 2011.

Angstrom-dep® ALD systems are widely used in the fields of semiconductor process, nanotechnologies, fuel-cell catalysis, electrode materials, solar cell and bio-mimic thin films.

Key Advantages:

  • The most professional system for both wafer and powder ALD applications, with 20 years industrial experiences.

  • Affordable, reliable, and easy to use.

  • Separate wafer and powder chambers in a single system.

  • Fast-loading, transparent standard powder chamber (bottle).

  • A specially designed valve protects sensitive powder samples from O2 and H2O exposure during transfer to and from a glovebox.

  • UV activation for the powder system.

Wafer

Powder

Isolation Valve

20 years of ALD experiences

  • Specialized not only thermal ALD, but also plasma assisted ALD, porous material ALD and powder ALD.

  • Focused ALD system functions, reliabilities and practicality.

Powder ALD

  • Batch processing designed for powder ALD.

  • A transparent chamber allows in-situ observation of the powders.

  • Powders can be collected with ease.

  • The ALD container is simple to clean.

  • Helps prevent cross-contamination between powder samples.

wider temperature ranges

  • 425°C：Wafer holder temperature. Satisfy most ALD requirements.

  • 325°C：For both powder and wafer ALD.

  • 280°C：For both powder and wafer ALD.

corrosive precursor allowed

  • Low temperature ALD, especially important for organic polymer ALD.

Modularized design

  • Easy to upgrade and maintain.

  • Plasma, powder ALD, and ozone modules can easily be added to an existing wafer ALD system.

  • Separate wafer and powder chambers in a single instrument.

wafer ALD

  • The heated sample holder enables single-chamber operation.

  • The drawer-style design allows for rapid wafer loading.

  • Temperature adjusts quickly.

  • Easy to operate and maintain.

POWDER MODULE

PRECURSOR MODULE

WAFER MODULE

PLASMA& OZONE

Angstrom Thinfilm Technologies

2825 Broadbent Business Park, Unit AAlbuquerque, NM 87107, USA

Headquarter

1120 Nimitz Ln, Foster City, CA 94404, USA