Cost effective, as low as 45K!

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Mini Wafer Systems

Mini Wafer system include：

  • Bench type, single wafer 4 inch；

  • Aluminium alloy sample holder for smaller size samples;

  • Compact, well-engineered design for controlled processing

  • One separate water line

  • Two metal organic precursor lines, with one heating mentle for low evaporation precursor

System Architecture

Cost-effective with high quality

Designed to be affordable, convenient, and space-efficient while delivering high-end thermal ALD coating capabilities.

Substrates
Vapor Delivery
Process Control

≤4 inch wafer samples

High-Speed Manifold

Thermal &Ozone

A well-designed platform for wafer sample research , optimized for high-aspect-ratio samples, Compatible with low-evaporation precursor processes

Fast-actuating pneumatic ALD valves with multi-zone heating eliminate cold spots and ensure repeatable millisecond precursor dosing cycles.

Compatible with standard thermal deposition of metal oxide, nitride, and pure metal layers.

Specification table

500 °C

maximum substrate heating

≤ 4 in

holder for 4 inch and smaller

3 lines

precursor delivery channels

Contact Engineering Team

Configure Your ALD System

Consult directly with thinfilm process specialists to review custom chamber volumes, gas delivery configurations, and specific precursor chemistries.

Angstrom Thinfilm Technologies

2825 Broadbent Business Park, Unit AAlbuquerque, NM 87107, USA

Headquarter

1120 Nimitz Ln, Foster City, CA 94404, USA