Customerized ALD Systems
Wafer system:
4 to 12 inch sample stage.
Load lock.
glove box.
Plasma enhanced.
Powder system:
0-20 kilogram powder systems.
Multiple powder chambers (eg. 250mL for research and 6L for mass production).
UV-light activation.
special designed valve system to seal glass chamber before/after load to the system( avoid water and oxygen between glovebox transfer) .
3D coating chamber system:
Customer designed heated chamber with our ALD precursor delivery.
Wafer/Powder/3D coating combined system:
Above Wafer, powder and 3D coating chambers, separated chambers in one system.
Other customer designed systems upon request
Key Features:
Affordable, reliable, and user-friendly.
Multiple dedicated chambers with distinct functions in a single system.
Rapid-loading, transparent standard powder chamber (bottle).
A specially designed valve protects sensitive powder samples from O2 and H2O during transfer to and from the glovebox.
UV activation integrated into the powder system.
Wafer
Powder
Isolation Valve
Configure Your ALD System
Consult directly with thinfilm process specialists to review custom chamber volumes, gas delivery configurations, and specific precursor chemistries.
Angstrom Thinfilm Technologies
2825 Broadbent Business Park, Unit AAlbuquerque, NM 87107, USA
Headquarter
1120 Nimitz Ln, Foster City, CA 94404, USA